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users manual target device v850e/ms1 tm ie-703102-mc-em1, IE-703102-MC-EM1-A in-circuit emulator optional board 1991 ? document no. u13876ej1v0um00 (1st edition) date published december 1998 n cp(k) printed in japan 1998
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3 v850e/ms1 is a trademark of nec corporation. windows is either a registered trademark or a trademark of microsoft corporation in the united states and/or other countries. pc/at is a trademark of international business machines corporation. ethernet is a trademark of xerox corporation. unix is a registered trademark in the united states and other countries, licensed exclusively through x/open company limited. the information in this document is subject to change without notice. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or of others. m7a 96. 10
4 regional information some information contained in this document may vary from country to country. before using any nec product in your application, piease contact the nec office in your country to obtain a list of authorized representatives and distributors. they will verify: device availability ordering information product release schedule availability of related technical literature development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, ac supply voltages, and so forth) network requirements in addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. nec electronics inc. (u.s.) santa clara, california tel: 408-588-6000 800-366-9782 fax: 408-588-6130 800-729-9288 nec electronics (germany) gmbh duesseldorf, germany tel: 0211-65 03 02 fax: 0211-65 03 490 nec electronics (uk) ltd. milton keynes, uk tel: 01908-691-133 fax: 01908-670-290 nec electronics italiana s.r.l. milano, italy tel: 02-66 75 41 fax: 02-66 75 42 99 nec electronics (germany) gmbh benelux office eindhoven, the netherlands tel: 040-2445845 fax: 040-2444580 nec electronics (france) s.a. velizy-villacoublay, france tel: 01-30-67 58 00 fax: 01-30-67 58 99 nec electronics (france) s.a. spain office madrid, spain tel: 01-504-2787 fax: 01-504-2860 nec electronics (germany) gmbh scandinavia office taeby, sweden tel: 08-63 80 820 fax: 08-63 80 388 nec electronics hong kong ltd. hong kong tel: 2886-9318 fax: 2886-9022/9044 nec electronics hong kong ltd. seoul branch seoul, korea tel: 02-528-0303 fax: 02-528-4411 nec electronics singapore pte. ltd. united square, singapore 1130 tel: 65-253-8311 fax: 65-250-3583 nec electronics taiwan ltd. taipei, taiwan tel: 02-2719-2377 fax: 02-2719-5951 nec do brasil s.a. electron devices division rodovia presidente dutra, km 214 07210-902-guarulhos-sp brasil tel: 55-11-6465-6810 fax: 55-11-6465-6829 j98. 11
5 introduction readers this manual is intended for users who design and develop application systems using the v850e/ms1 tm . purpose the purpose of this manual is to describe the proper operation of the ie-703102-mc- em1 and IE-703102-MC-EM1-A, and their basic specifications. organization this manual is broadly divided into the following parts. ? overview ? name and function of components ? cautions how to read this manual it is assumed that the reader of this manual has general knowledge of electrical engineering, logic circuits, and microcontrollers. the ie-703102-mc-em1 and IE-703102-MC-EM1-A are used connected to the ie-703102-mc in-circuit emulator. this manual explains the basic setup procedure and switch settings of the ie-703102-mc-em1 and ie-703102-mc- em1-a. for the names and functions, and the connection of parts, refer to the ie-703102-mc users manual , which is a separate volume. to understand the basic specifications and operation methods broadly ? read this manual in the order listed in contents . to know the operation methods and command functions of the ie-703102-mc, ie- 703102-mc-em1, and IE-703102-MC-EM1-A ? read the users manual of the debugger (separate volume) that is used. conventions note : footnote for item marked with note in the text caution : information requiring particular attention remark : supplementary information numeral representations: binary ? or b decimal ? hexadecimal ? h prefixes representing the powers of 2 (address space, memory capacity): k (kilo): 2 10 = 1024 m (mega): 2 20 = 1024 2 terminology the meanings of terms used in this manual are listed below. target device device that is emulated. target system the system (user-built system) to be debugged. this includes the target program and user-configured hardware.
6 product names unless otherwise specified, the ie-703102-mc-em1 is treated as the representative model in this manual. when using the IE-703102-MC-EM1-A, read ie-703102-mc-em1 as ie- 703102-mc-em1-a. for functional differences between ie-703102-mc-em1 and ie- 703102-mc-em1-a, refer to chapter 1 overview. related documents the related documents indicated in this publication may include preliminary versions. however, preliminary versions are not marked as such. { documents related to v850e/ms1 document name document number v850e/ms1 users manual-hardware u12688e v850e/ users manual-architecture u12197e m pd703100-40, 703101-33, 703102-33 data sheet to be prepared m pd703100-a40, 703101-a33, 703102-a33 data sheet to be prepared m pd70f3102-33 data sheet u13844e m pd70f3102-a33 data sheet u13845e { documents related to development tools (users manual) product name document number ie-703102-mc (in-circuit emulator) u13875e ie-703102-mc-em1, IE-703102-MC-EM1-A (in-circuit emulator optional board) this manual operation unix tm based u12839e operation windows tm based u12827e c language u12840e ca850 (c compiler package) assembly language u10543e id850 (integrated debugger) operation windows based u13716e basics u13430e technical u13431e rx850 (real-time os) installation u13410e fundamental under preparation technical u13772e rx850 pro (real-time os) installation u13774e rd850 (task debugger) note u11158e rd850 (ver. 3.0) (task debugger) u13737e az850 (system performance analyzer) operation u11181e note supports id850 (ver. 1.31 only)
7 contents chapter 1 overview ......................................................................................................... ................11 1.1 hardware configuration ...................................................................................................... .......12 1.2 features (when connected to ie-703102-mc)..........................................................................13 1.3 function specifications (when connected to ie-703102-mc) ................................................14 1.4 system configuration ........................................................................................................ .........15 1.5 contents in carton .......................................................................................................... ............16 1.6 connection between ie-703102-mc and ie-703102-mc-em1 ..................................................17 chapter 2 name and function of components.................................................................19 2.1 component name and function of ie-703102-mc-em1 ..........................................................19 2.2 clock settings.............................................................................................................. ................21 2.3 mode pin setting ............................................................................................................ ............22 2.3.1 mode pin setting when emulator is used as stand-alone unit ...................................................... 22 2.3.2 mode pin setting when emulator is used connected to target system ......................................... 22 2.4 power supply settings ....................................................................................................... ........23 2.4.1 jp2 setting when the emulator operates as a stand-alone unit and target system power is off.... 23 2.4.2 jp2 setting when power of the target system is on ....................................................................... 23 chapter 3 factory settings .................................................................................................. .......25 chapter 4 cautions......................................................................................................... .................27 4.1 v dd and hv dd of target system ..................................................................................................27 4.2 x1 signal ................................................................................................................... ...................27 4.3 pin termination ............................................................................................................. ..............28 4.4 internal ram and rom ........................................................................................................ .......29 4.5 port 4 to 6, a, and b ....................................................................................................... .............30 4.6 bus interface pin ........................................................................................................... ..............31 4.7 emulation memory operation timing difference.....................................................................33 appendix a dimensions ...................................................................................................... ..............35 appendix b example of use of connector for target connection ....................41 appendix c connectors for target connection.............................................................43 c.1 use ......................................................................................................................... .......................43 c.2 cautions on handling connectors ............................................................................................4 5 appendix d mounting of plastic spacer ..............................................................................47
8 list of figures figure no. title page 1-1. system configuration ....................................................................................................... ................................ 15 1-2. contents in carton......................................................................................................... ................................... 16 1-3. connection between ie-703102-mc and ie-703102-mc-em1....................................................................... .. 17 2-1. ie-703102-mc-em1........................................................................................................... ............................... 19 2-2. power supply settings (when the emulator operates as a stand-alone unit and target system power is off) ............................................................................................................................... ........................................... 23 2-3. power supply setting (when power of the target system is on)............................................................... ..... 23 4-1. schematic diagram of power supply flow..................................................................................... .................. 27 4-2. diagram of x1 signal flow .................................................................................................. ............................. 28 4-3. circuit diagram of cksel pin ............................................................................................... ........................... 28 4-4. circuit diagram of port 4 to 6, a, and b ................................................................................... ........................ 30 c-1. mounting of nqpack144sd.................................................................................................... ........................ 43 c-2. mounting device............................................................................................................ ................................... 44 c-3. nqpack100sd and device pin ................................................................................................. ..................... 44 d-1. mounting method of plastic spacer.......................................................................................... ........................ 47
9 list of tables table no. title page 2-1. clock setting (when the emulator is used as a stand-alone unit) ............................................................ ..... 21 2-2. clock setting (when the emulator is used in target system connection)...................................................... 21 2-3. mode pin setting when emulator is used as stand-alone unit ................................................................. .... 22 2-4. mode pin setting when emulator is used connected to target system........................................................ 22 4-1. memory capacity limitation list ............................................................................................ .......................... 29 4-2. bus interface pin operation list........................................................................................... ............................ 31
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11 chapter 1 overview the ie-703102-mc-em1 is an optional board for the in-circuit emulator ie-703102-mc. by connecting the ie- 703102-mc-em1 to ie-703102-mc, hardware and software can be debugged efficiently in system development using the v850e/ms1. ie-703102-mc-em1 is an optional board when hv dd = 5 v IE-703102-MC-EM1-A is an optional board when hv dd = 3.3 v in this manual, the basic setup sequences and switch settings of the ie-703102-mc-em1 when connecting it to the ie-703102-mc are described. for the names and functions of the parts of the ie-703102-mc, and for the connection of elements, refer to the ie-703102-mc users manual (u13875e) which is a separate volume.
chapter 1 overview 12 optional board ie-703102-mc-em1 IE-703102-MC-EM1-A ie-703102-mc can be used as in-circuit emulator for v850e/ms1 by adding these boards. extension probe (sc- sda note 1 ) general-purpose extension probe made by tokyo eletech corporation. pc interface board ie-70000- -if-b ie-70000- -if-c ie-70000-pci-if ie-70000-cd-if-a these boards are used to connect the ie-703102-mc to a personal computer. these boards are inserted in the expansion slot of the personal computer. : 98 (for pc-9800 series c bus) note 2 pc (for ibm pc/at tm compatible isa bus) note 2 ie-70000-pci-if : for pci bus ie-70000-cd-if-a : for pcmcia socket network module (ie-70000-mc-sv3) the module is used when a workstation controls the ie-703102-mc via ethernet tm . power adapter (ie-70000-mc-ps-b) ac adapter dedicated to the necs in-circuit emulator separatel y sold hardware 1.1 hardware configuration notes 1. for further information, contact daimaru kogyo co., ltd . tokyo electronic components division (tel +81-3-3820-7112) osaka electronic components division (tel +81-6-244-6672) 2. these interface boards cannot be used for the pc98-nx series. optional hardware separatel y sold hardware in-circuit emulator (ie-703102-mc)
chapter 1 overview 13 1.2 features (when connected to ie-703102-mc) { maximum operation frequency: 40 mhz (hv dd = 3.3 v or 5.0 v operation) { extremely lightweight and compact { higher equivalence with target device can be achieved by omitting buffer between signal cables. { following pins can be masked. reset, nmi, wait, hldrq { two methods of connection to target system: ? direct connection of the ie-703102-mc-em1 ? attach an extension probe (sold separetely) to the connection tab of the ie-703102-mc-em1. { dimensions of the ie-703102-mc-em1 are as follows. parameter value power dissipation 0.4 w (at 40-mhz operation frequency) note height 15 mm length 207 mm external dimensions (refer to appendix a dimensions ) width 96 mm weight 170 g note the power dissipation is 11.4 w when ie-703102-mc + ie-703102-mc-em1.
chapter 1 overview 14 1.3 function specifications (when connected to ie-703102-mc) parameter specification internal rom 128 kbytes emulation memory capacity external memory 2 mbytes internal rom 128 kbytes in rom-less mode 2 mbytes execution/pass detection coverage memory capacity external memory when using irom 1 mbyte memory access detection coverage memory capacity external memory 1 mbyte trace memory capacity 168 bits 32 kframes time measurement function can be measured with time tag and timers (3 lines) 8-bit external trace is possible external logic probe event setting for trace/break is possible event break step execution break forced break break function fail safe break illegal access to peripheral i/o access to guard space write to the rom space caution some of the functions may not be supported depending on the debugger used.
chapter 1 overview 15 1.4 system configuration the system configuration when connecting the ie-703102-mc-em1 to the ie-703102-mc, which is then connected to a personal computer (pc-9800 series or pc/at compatible) is shown below. figure 1-1. system configuration remark <1> personal computer (pc-9800 series or pc/at compatible) <2> debugger (sold separately) <3> pc interface board (ie-70000-98-if-b/ie-70000-98-if-c, ie-70000-pc-if-b/ie-70000-pc-if-c : sold separately ) <4> pc interface cable (included with ie-703102-mc) <5> in-circuit emulator (ie-703102-mc: sold separately) <6> in-circuit emulator option board (ie-703102-mc-em1) <7> external logic probe (included with ie-703102-mc) <8> extension probe (sc-144sd, sc-144sd pr: sold separately) <9> connector for emulator connection (yqpack144sd: included) <10> connector for target connection (nqpack144sd: included) <11> power adapter (ie-70000-mc-ps-b: sold separately) <12> ac100-v power cable (sold separately: included with ie-70000-mc-ps-b) <13> ac220-v power cable (sold separately: included with ie-70000-mc-ps-b) for pc-9800 series for pc/at [magnified drawing: example of use of connector for target connection] target system <12> <13> <11> <5> <6> <7> <4> <3> <1> <2> <8> <10> <9> target system <9> <10>
chapter 1 overview 16 1.5 contents in carton the carton of the ie-703102-mc-em1 contains a main unit, guarantee card, packing list, and accessory bag. make sure that the accessory bag contains this manual and connector accessories. in case of missing or damaged contents, contact an nec sales representative or an nec distributor. figure 1-2. contents in carton <1> ie-703102-mc-em1 <2> accessory bag <3> guarantee card <4> packing list <1> ie-703102-mc-em1 1 <2> accessory bag 1 <3> guarantee card 1 <4> packing list 1 make sure that the accessory bag contains this manual and an accessory list (1 sheet).
chapter 1 overview 17 1.6 connection between ie-703102-mc and ie-703102-mc-em1 the procedure for connecting the ie-703102-mc and ie-703102-mc-em1 is described below. caution connect carefully so as not to break or bend connector pins. <1> remove the pod cover (upper and lower) of the ie-703102-mc. <2> set the pga socket lever of the ie-703102-mc-em1 to the open position as shown in figure 1-3 (b). <3> connect the ie-703102-mc-em1 to the pga socket at the back of the pod (refer to figure 1-3 (c) ). when connecting, position the ie-703102-mc and ie-703102-mc-em1 so that they are horizontal. spacers can be connected to fix the pod. (refer to appendix d mounting of plastic spacer ) <4> set the pga socket lever of the ie-703102-mc-em1 to the close position as shown in figure 1-3 (b). <5> fix the ie-703102-mc-em1 between the pod covers (upper and lower) with nylon rivets. <6> secure the pod cover (upper) end with nylon rivets. figure 1-3. connection between ie-703102-mc and ie-703102-mc-em1 (1/2) (a) overview ie-703102-mc nylon rivets upper cover ie-703102-mc-em1 lower cover nylon rivets nylon rivets
chapter 1 overview 18 figure 1-3. connection between ie-703102-mc and ie-703102-mc-em1 (2/2) (b) pga socket lever of ie-703102-mc-em1 (c) connecting part (ie-703102-mc-em1) pin a1 location : insertion guide : ie-703102-mc insertion area close open
19 chapter 2 name and function of components this chapter describes the names, functions, and switch settings of components comprising the ie-703102-mc- em1. for the details of the pod, jumper, and switch positions, etc., refer to the ie-703102-mc users manual . 2.1 component name and function of ie-703102-mc-em1 figure 2-1. ie-703102-mc-em1 (a) top view (b) bottom view tp1 connector for connection to ie-703102-mc sw1 direct pll led cksel (green) v850e/ms1 i/o chip tp2 tp3 tp4 tp5 tp6 jp1 1 2 7 8 osc direction of pin 1 of the connector for target connection direction of pin 1 of the connector for target connection connector for target connection 1 2 3 4 jp2
chapter 2 name and function of components 20 (1) test pin (tp1 to tp6) to leave the dma cycle or refresh cycle in the tracer, or break these cycles, connect these pins to the external logic probe. tp1: gnd tp2: refrq tp3: dmaak0 tp4: dmaak1 tp5: dmaak2 tp6: dmaak3 (2) sw1 this is a switch for clock mode switching (for details, refer to 2.2 clock settings ). (3) jp1 this is a switch jumper for the clock supply source (for details, refer to 2.2 clock settings ). (4) jp2 this is a switch jumper for the power supply (for details, refer to 2.4 power supply settings ). (5) led (cksel: green) led status when used as a stand-alone unit when used in target system connection on sw1 = direct the cksel signal from the target system is high off sw1 = pll the cksel signal from the target system is low (6) connector for ie-703102-mc connection this is a connector for connecting the ie-703102-mc. (7) connector for target connection this is a connector for connecting the target system or the extension probe.
chapter 2 name and function of components 21 2.2 clock settings this section describes the clock settings. for jp1 and sw1, refer to figure 2-1. table 2-1. clock setting (when the emulator is used as a stand-alone unit) clock supply source setting clock mode setting clock supply method jp1 setting note sw1 setting (cksel setting) pll mode direct pll internal clock direct mode 1 2 7 8 direct pll note setting any other state is prohibited. table 2-2. clock setting (when the emulator is used in target system connection) clock supply source setting clock mode setting clock supply method jp1 setting note 1 sw1 setting (cksel setting) cksel setting of target system pll mode direct pll low level internal clock/target clock note 2 direct mode 1 2 7 8 direct pll high level notes 1. setting any other state is prohibited. 2. switching the internal clock and target clock is done with the debugger.
chapter 2 name and function of components 22 2.3 mode pin setting the emulator operation mode can be changed with the mode pin setting. 2.3.1 mode pin setting when emulator is used as stand-alone unit when the emulator is used as a stand-alone unit, mode0 and mode1 in the emulator are set as follows. the setting cannot be changed. table 2-3. mode pin setting when emulator is used as stand-alone unit settings inside emulator emulator operation mode0 mode1 single-chip mode 0 low-level input high-level input 2.3.2 mode pin setting when emulator is used connected to target system when the emulator is connected to a target system, set the mode pins of the target system as follows based on the emulator operations. the mode2 and mode3 signals in the target system are not used in the emulator. table 2-4. mode pin setting when emulator is used connected to target system target system setting emulator operation mode0 mode1 rom-less mode 0 low-level input low-level input rom-less mode 1 high-level input low-level input single-chip mode 0 low-level input high-level input single-chip mode 1 high-level input high-level input
chapter 2 name and function of components 23 2.4 power supply settings using the jp2 setting, the ie-703102-mc-em1 can switch between operation using the emulator as a stand-alone unit (using the power of the emulator) and operation using the emulator connected to the target system (using the power of the target system). 2.4.1 jp2 setting when the emulator operates as a stand-alone unit and target system power is off the ie-703102-ms-em1 operates using the emulators power supply when the emulator operates as a stand- alone unit and target system power is off. depending on the product, the condition of the power is as follows. ie-703102-mc-em1 : v dd = 3.3 v, hv dd = 5.0 v IE-703102-MC-EM1-A : v dd = 3.3 v, hv dd = 3.3v figure 2-2 shows the jp2 setting. caution if the jp2 setting is incorrect, the emulator may be damaged. figure 2-2. power supply settings (when the emulator operates as a stand-alone unit and target system power is off) 1 2 3 4 jp2 set both 1-2 and 3-4 as open 2.4.2 jp2 setting when power of the target system is on the ie-703102-mc-em1 operates using the target systems power supply when the power of the target system is on. figure 2-3 shows the jp2 setting. caution if the jp2 setting is incorrect, the emulator may be damaged. figure 2-3. power supply setting (when power of the target system is on) 1 2 3 4 jp2 set 1-2 as open and 3-4 as short
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25 chapter 3 factory settings item setting remark jp1 1 2 7 8 all settings other than those set in the factory are prohibited. jp2 1 2 3 4 setting that supplies the ie-703102-mc-em1 with the power of the emulator (when the emulator operates as a stand-alone unit and target system power is off). sw1 direct pll set to pll mode. crystal oscillator 8.000-mhz crystal oscillator is mounted. if sw1 is set to the factory setting, the cpu operates at 40 mhz.
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27 chapter 4 cautions 4.1 v dd and hv dd of target system (1) v dd and hv dd in the target system are used to operate the circuit in the emulator. (2) when jp2 is set as 1-2 : open and 3-4 : short, the evaluation chip in the emulator operates on v dd and hv dd from the target system. (3) when jp2 is set as 1-2 : open and 3-4 : open, the emulator recognizes the target system power is off and operates with the 3.3 v power supply. figure 4-1. schematic diagram of power supply flow ie-703102-mc-em1 i/o chip target system cv dd v dd hv dd relay power supply circuit evaluation chip ie-703102-mc 1 2 3 4 jp2 1 2 3 4 jp2 4.2 x1 signal the input signal (x1 signal) from the target system is delayed (for t plh = t phl = 13.2 ns (max.)) because it passes through vhc157 before it is input to the i/o chip of the emulator. in addition, the dc characteristics change. the input voltage becomes v ih = 2.31 v (min.) and v il = 0.99 v (max.). the input current becomes i in = 1.0 m a (max.).
chapter 4 cautions 28 figure 4-2. diagram of x1 signal flow i/o chip ie-703102-mc-em1 x1 signal target system x1 pin vhc157 4.3 pin termination (1) mode0 to mode3 pins when the emulator operates as a stand-alone unit, the operation mode of the emulator is single-chip mode 0. the mode0 to mode3 pins are connected as follows. mode0: connected to v ss via a resistor (33 k w ). (pull-down) mode1: connected to v dd via a resistor (5.1 k w ). (pull-up) mode2: unconnected mode3: unconnected (2) reset pin this pin is connected to v dd via a resistor (5.1 k w ). (pull-up) (3) cksel pin pull-up/pull-down switching is possible with sw1. figure 4-3. circuit diagram of cksel pin vhct541 i/o chip sw1 cksel cksel pin 33 k w 100 w hv dd
chapter 4 cautions 29 4.4 internal ram and rom because the internal ram (iram) and internal rom (irom) capacities of the emulator are set in steps, the memory capacity is different from that of the target device. if access is performed to addresses that exceed the target device capacity, the memory of the emulator is accessed. memory capacities are as follows. table 4-1. memory capacity limitation list (a) iram capacity (unit: byte) (b) irom capacity (unit: byte) target device emulator target device emulator (emulation memory) 1 k 1 k 1 k to 32 k 32 k 2 k 2 k 33 k to 64 k 64 k 3 k 3 k 65 k to 128 k(v850e/ms1) 128 k 4 k (v850e/ms1) 4 k 129 k to 256 k 256 k 5 k to 6 k 6 k 257 k to 512 k 512 k note 7 k to 8 k 8 k 9 k to 10 k 10 k 11 k to 12 k 12 k 13 k to 16 k 16 k 17 k to 20 k 20 k 21 k to 24 k 24 k 25 k to 28 k 28 k 29 k to 36 k 36 k 37 k to 44 k 44 k 45 k to 52 k 52 k 53 k to 60 k 60 k note the emulator is mounted irom emulation memory of 512 kbytes.
chapter 4 cautions 30 4.5 port 4 to 6, a, and b ports 4 to 6, a, and b are connected to vhct541, vhc541, and vhct00, respectively. figure 4-4. circuit diagram of port 4 to 6, a, and b evaluation chip port 4 port 5 port 6 port a port b vhct541 vhc541 vhct541 vhc541 vhct00 vhct541 vhct541 emulation memory (2 mbytes) target system
chapter 4 cautions 31 4.6 bus interface pin there are the following differences between the emulator and the target device in the operation of the pins for bus interface. table 4-2. bus interface pin operation list (1/3) (a) during break internal memory external memory internal rom internal ram internal peripheral i/o emulation ram target system pin name waiting for emulator command rrwrwrwrw a0 to a23 note note note note d0 to d15 hi-z hi-z note note we h h h note oe h h h note rd h h h note adv/bcyst note h note note uwr/ucas h h h note lwr/lcas h h h note iord h h h note iowr h h h note cs0 to cs7 h h h note ras0 to ras7 hh h note refrq h h h note wait invalid note maskable hldrq maskable maskable maskable hldak note note note note performs the same operation as the cycle that is generated by the target device program execution. remarks 1. r : read w: write 2. h : high-level output hi-z : high-impedance
chapter 4 cautions 32 table 4-2. bus interface pin operation list (2/3) (b) during user program execution internal memory external memory internal rom internal ram internal peripheral i/o emulation ram target system pin name frfrwrwfrwfrw a0 to a23 note note note d0 to d15 hi-z note note we h h note oe h h note rd h h note adv/ bcyst h note note uwr/ ucas hh note lwr/ lcas hh note irod h h note iowr h h note cs0 to cs7 hh note ras0 to ras7 hh note refrq h h note wait note maskable hldrq maskable maskable hldak note note note performs the same operation as the cycle that is generated by the target device program execution. remarks 1. f : fetch r : read w: write 2. h : high-level output hi-z : high-impedance
chapter 4 cautions 33 table 4-2. bus interface pin operation list (3/3) (c) refresh cycle pin name operation a0 to a23 note d0 to d15 note we note oe note rd note adv/bcyst note uwr/ucas note lwr/lcas note iord note iowr note cs0 to cs7 note ras0 to ras7 note refrq note wait maskable hldrq maskable hldak note note performs the same operation as the cycle that is generated by the target device program execution. 4.7 emulation memory operation timing difference when the area of the dram, synchronous flash memory, or page rom in the target system has been allocated to the emulation memory, the operation timing is the sram access timing. when measuring the performance by using the emulation memory, adjust the setting so that the wait set matches the memory access timing that is actually used.
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35 appendix a dimensions (1) ie-703102-mc + ie-703102-mc-em1 (unit: mm) 461 55 166 58.8 57 90 27 240 top view side view ie-703102-mc-em1 ie-703102-mc bottom view top view 15.88 207 29.0 96 37.5 29.0 pin 1 direction
appendix a dimensions 36 (2) sc-144sd (unit: mm) 109 144 72 37 108 1 73 36 43 13 13 40 130 43 213 46
appendix a dimensions 37 (3) nqpack144sd (unit: mm) [top view] [side view] [bottom view] 5.5 1.85 0.2 21.05 0.5 0.5 0.18 3.9 3.7 1.2 9.45 1 36 73 108 37 72 144 109 23.0 12.0 20.1 4- f 2.0 height of projection 1.8 0.2 73 72 109 144 1 37 36 108 7.0 7.0 27.0 0.5 35 = 17.5 0.5 18.9 26.2 20.1 2.5 2.5 22.65 3-r1.5 3- f 1.0 c1.5 0.3
appendix a dimensions 38 (4) yqpack144sd (unit: mm) [top view] [side view] [bottom view] 3.7 3.1 2.5 9.0 2.2 3.9 1.2 7.4 2.3 0.3 0.25 0.25 0.3 144 109 108 73 72 37 1 36 22.8 19.6 c1.5 20.8 0.2 109 144 7.0 22.65 0.5 35 = 17.5 0.5 4- f 2.2 c2.0 108 7.0 27.0 29.0 19.4 73 72 37 4-r1.5 3-r2.5 1 36 16.4 18.8 21.2 23.6 3- f 1.0
appendix a dimensions 39 (5) hqpack144sd (unit: mm) [top view] [side view] [bottom view] 7.0 0.1 22.65 0.15 0.5 35 = 17.5 0.1 7.0 27.0 29.0 19.4 4- f 2.2 c2.0 18.4 16.0 23.9 2.75 2.75 3.95 3.95 4-r1.5 3-r2.5 109 144 108 73 72 37 1 36 3- f 1.0 3.9 1.2 7.4 2.3 3.1 2.25 1.6 0.25 0.2 22.8 19.6 c1.5 144 109 108 73 72 37 1 36 21.4 0.2
40 [memo]
41 appendix b example of use of connector for target connection (1) when directly connecting device to target system (connector for target connection is not used) (2) when equipping device by using connector for target connection fastening screws hqpack144sd nqpack144sd target system device (3) connection between emulator and target system (a) when extension probe is not used note connector for emulator connection (yqsocket144sdn) can be inserted at this position for height adjustment. target system device target system nqpack144sd yqpack144sd note
appendix b example of use of connector for target connection 42 (b) example of use of extension probe note connector for emulator connection (yqsocket144sdn) can be inserted at this position for height adjustment. target system nqpack144sd yqpack144sd note extension probe
43 appendix c connectors for target connection c.1 use (1) when mounting nqpack144sd to target system <1> coat the tip of four projections (points) at the bottom of the nqpack144sd with two-component type epoxy adhesive (cure time longer than 30 min.) and bond the nqpack144sd to the target system. if not bonded properly, the pad of the printed circuit board may peel off when the emulator is removed from the target system. if the lead of the nqpack144sd does not coincide with the pad of the target system easily, perform step <2> to adjust the position. <2> to adjust the position, insert the guide pins for position-adjustment (nqguide) provided with nqpack144sd into the pin holes at the upper side of nqpack144sd (refer to figure c-1 ). the diameter of a hole is f = 1.0 mm. there are three non-through holes (refer to appendix a dimensions ). <3> after setting the hqpack144sd, solder nqpack144sd to the target system. by following this sequence, adherence of flux or solder sputtering to contact pins of the nqpack144sd can be avoided. recommended soldering condition reflow : 240 c, 20 sec. max. partial heating : 240 c, 10 sec. max. (per pin row) <4> remove the guide pins. figure c-1. mounting of nqpack144sd remark nqpack144sd: connector for target connection hqpack144sd: cover for device installation nqpack144sd guide pins (nqguide) hqpack144sd target system
appendix c connectors for target connection 44 (2) when setting device caution check for abnormal conditions such as resin burr or bent pins before setting a device to the nqpack144sd. moreover, check that the hold pins of the hqpack144sd are not broken or bent before setting hqpack144sd. if there are broken or bent pins, fix them with a thin, flat plate such as a blade. <1> make sure that the nqpack144sd is clean and the device pins are parallel (flat) before setting a device to the nqpack144sd. then, after mounting the nqpack144sd to the target board, set the device and hqpack144sd (refer to figure c-2 ). <2> using the screws provided with the hqpack144sd (four locations: m2 6 mm), secure the hqpack144sd, device, and nqpack144sd. tighten the screws in a crisscross pattern with the provided screwdriver or driver with torque gauge (avoid tightening strongly only one screw). tighten the screws with 0.55 kg f cm (0.054 n m) max. torque. excessive tightening may diminish conductivity. at this time, each pin is fixed inside the plastic wall dividers by the contact pin of the nqpack144sd and the hold pin of the hqpack144sd (refer to figure c-3 ). thus, pins cannot cause a short with pins of neighboring devices. figure c-2. mounting device fastening screws hqpack144sd nqpack144sd target system device figure c-3. nqpack100sd and device pin hold pin of hqpack144sd divider device pin contact pin of nqpack144sd
appendix c connectors for target connection 45 c.2 cautions on handling connectors (1) when taking connectors out of the case, remove the sponge while holding the main unit. (2) when soldering the nqpack144sd to the target system, cover the hqpack144sd to protect it against splashing flux. recommended soldering conditions reflow : 240 c, 20 sec. max. partial heating : 240 c, 10 sec. max. (per pin row) (3) check for abnormal conditions such as resin burr or bent pins before setting a device to the nqpack144sd. moreover, check that the hold pins of the hqpack144sd are not broken or bent before setting hqpack144sd. if there are broken or bent pins, fix them with a thin, flat plate such as a blade. (4) when securing the yqpack144sd (connector for emulator connection) or hqpack144sd to the nqpack144sd with screws, tighten the four screws temporarily with the provided screwdriver or driver with torque gauge, then tighten the screws in a crisscross pattern (with 0.054 n m max. torque). excessive tightening of only one screw may diminish conductivity. if the conductivity is diminished after screw-tightening, stop tightening, remove the screws and check whether the nqpack144sd is stained and make sure the device pins are parallel. (5) device pins do not have high strength. repeatedly connecting to the nqpack144sd may cause pins to bend. when setting a device to the nqpack144sd, check and adjust bent pins.
46 [memo]
47 appendix d mounting of plastic spacer this chapter describes the mounting method for the plastic spacer supplied with the ie-703102-mc. when using the emulator connected to the target system, mount the plastic spacer as shown in figure d-1 to fix the pod horizontally. (1) mounting ie-703102-mc to plastic spacer <1> remove the nylon rivet from the rear part of the pod. <2> tighten the plastic spacer with the supplied plastic screw. <3> to adjust the height, use a user spacer or stand. figure d-1. mounting method of plastic spacer target system plastic spacer
48 [memo]
although nec has taken all possible steps to ensure that the documentation supplied to our customers is complete, bug free and up-to-date, we readily accept that errors may occur. despite all the care and precautions we've taken, you may encounter problems in the documentation. please complete this form whenever you'd like to report errors or suggest improvements to us. hong kong, philippines, oceania nec electronics hong kong ltd. fax: +852-2886-9022/9044 korea nec electronics hong kong ltd. seoul branch fax: 02-528-4411 taiwan nec electronics taiwan ltd. fax: 02-2719-5951 address north america nec electronics inc. corporate communications dept. fax: 1-800-729-9288 1-408-588-6130 europe nec electronics (europe) gmbh technical documentation dept. fax: +49-211-6503-274 south america nec do brasil s.a. fax: +55-11-6465-6829 asian nations except philippines nec electronics singapore pte. ltd. fax: +65-250-3583 japan nec semiconductor technical hotline fax: 044-548-7900 i would like to report the following error/make the following suggestion: document title: document number: page number: thank you for your kind support. if possible, please fax the referenced page or drawing. excellent good acceptable poor document rating clarity technical accuracy organization cs 98.8 name company from: tel. fax facsimile message

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